Description
Riptide is named after a specific kind of water current with strong waves that occurs in the ocean, representing the philosophy of sea’s double-side, calm and unlimited strength. Built around powerful gaming-related features, the Riptide has given a powerful smash and immersed users in the sense of stability.
- Supports AMD AM5 Socket Ryzen™ 9000, 8000 and 7000 Series Processors
- 14+2+1 Phase Power Design, 80A Dr.MOS for VCore+SOC
- 4 x DDR5 DIMMs
- Supports Dual Channel, up to 8000+ (OC)
- 1 PCIe 5.0 x16, 1 PCIe 4.0 x16
- Graphics Output Options: 2 USB4 Type-C, 1 HDMI
- Realtek ALC4082 7.1 CH HD Audio Codec, Nahimic Audio
- 1 Blazing M.2 (PCIe Gen5x4)
- 2 Hyper M.2 (PCIe Gen4x4)
- 4 SATA3
- 2 USB4 Type-C (Rear),
- 1 USB 3.2 Gen2x2 Type-C (Front),
- 2 USB 3.2 Gen2 Type-A (Rear),
- 7 USB 3.2 Gen1 (3 Rear, 4 Front)
- 8 USB 2.0 (4 Rear, 4 Front)
- Killer 2.5G LAN
- 802.11be Wi-Fi 7 + Bluetooth
- Supports Toolless Multi-Layer M.2 Heatsink, M.2 Bottom Heatsink
Optimized VRM Design
- Exclusive 20K Cap with 1000uF Capacitance – The upgraded 20K Black capacitor not only extends the lifespan to 20,000 hours but also increases the capacitance value from 560uF to 1000uF, bringing several benefits: Higher Capacitance, Ripple, More Stable Output Current and Better Performance & System Stability
- 14+2+1 Power Phase Design – Featuring sturdy components and completely smooth power delivery to the CPU. Plus, it offers unmatched overclocking capabilities and enhanced performance with the lowest temperature for advanced gamers as well.
- Dr. MOS – Dr.MOS is the integrated power stage solution which is optimized for synchronous buck-set down voltage applications! Compared to traditional discrete MOSFETs, it intelligently delivers higher current for each phase, thus providing improved thermal result and superior performance.
- Hi-Density Power Connector – CPU overclocking requires higher current, ASRock Hi-Density Power connectors is able to withstand current higher traditional CPU 8-pin and ATX 24-pin connector, giving a more stable system as well as lowering the risk of fire under heavy overclocking.
8 Layer PCB design
The 8 Layer PCB provides stable signal traces and power shapes delivering lower temperature and higher energy efficiency for memory overclockin
Additional information
Weight | 0.0 g |
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