Asrock B860M LIGHTNING WIFI, Intel B860, 1851, Micro ATX, 4 DDR5, HDMI, DP, TB4, Wi-Fi 6E, 2.5G LAN, RGB, 4x M.2

£180.45

    Lightning series stands as a symbol of both speed and power. The design employs linear and angular elements, evoking the imagery of lightning – a spectacle of raw energy and breathtaking speed. Supports Intel&re…

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SKU: ASMBB860MLIGHTNINGWIFI Categories: ,

Description

 
 

Lightning series stands as a symbol of both speed and power. The design employs linear and angular elements, evoking the imagery of lightning – a spectacle of raw energy and breathtaking speed.

  • Supports Intel® Core™ Ultra Processors (Series 2) (LGA1851)
  • 12+1+1+1+1 Power Phase, 80A SPS for VCore+GT+SA
  • 4 x DDR5 DIMMs
  • Supports Dual Channel, up to 8666+ (OC)
  • 1 PCIe 5.0 x16
  • Graphics Output Options: 1 HDMI, 1 DisplayPort, 1 Thunderbolt™ 4 Type-C
  • Realtek ALC1220 7.1 CH HD Audio Codec, Nahimic Audio
  • 4 SATA3
  • 1 Blazing M.2 (PCIe Gen5x4)
  • 3 Hyper M.2 (PCIe Gen4x4)
  • 1 Thunderbolt™ 4 Type-C (Rear)
  • 3 USB 3.2 Gen2 (2 Rear, 1 Front Type-C)
  • 6 USB 3.2 Gen1 (4 Rear, 2 Front)
  • 6 USB 2.0 (2 Rear, 4 Front)
  • Killer 2.5G LAN
  • 802.11axe Wi-Fi 6E + Bluetooth
  • Supports BIOS Flashback, Memory OC Shield

 

Performance
  • Exclusive 20K Cap with 1000uF Capacitance – The upgraded 20K Black capacitor not only extends the lifespan to 20,000 hours but also increases the capacitance value from 560uF to 1000uF
  • 12+1+1+1+1 Power Phase Design – Featuring sturdy components and completely smooth power delivery to the CPU. Plus, it offers unmatched overclocking capabilities and enhanced performance with the lowest temperature for advanced gamers as well.
  • SPS (Smart Power Stage) – Dr.MOS design features the latest SPS (Smart Power Stage) technology. It’s optimized for monitoring current and temperature of each phase, thus delivering smoother and neater power to the CPU with enhanced performance and OC capability.
  • Hi-Density Power Connector – CPU overclocking requires higher current. ASRock Hi-Density Power Connectors are designed to withstand higher currents compared to traditional CPU and ATX power connectors, providing a more stable system and reducing the risk of fire during heavy overclocking.
  • 2oz Copper PCB – 2 ounce copper inner layers that provide stable signal traces and power shapes! Delivering lower temperature and higher energy efficiency for overclocking.
  • DDR5 XMP & EXPO Support – Derived from the “built for stable and reliable” designing concept, ASRock does not compromise on any details. This motherboard is built with high quality materials, enthusiasts are able to enjoy the boost of DDR5 memory over

Additional information

Weight 0.0 g

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