Asrock B860I LIGHTNING WIFI, Intel B860, 1851, Mini ITX, 2 DDR5, HDMI, TB4, Wi-Fi 6E, 2.5G LAN, RGB, 2x M.2

Lightning series stands as a symbol of both speed and power. The design employs linear and angular elements, evoking the imagery of lightning – a spectacle of raw energy and breathtaking speed.

• Supports Intel® Core™ Ultra Processors (Series 2) (LGA1851)
• 10+1+1+1+1 Power Phase, 110A SPS for VCore+GT+SA
• 2 x DDR5 DIMMs
• Supports Dual Channel, up to 9333+ (OC)
• 1 PCIe 5.0 x16
• Graphics Output Options: 1 HDMI, 1 Thunderbolt™ 4 Type-C
• Realtek ALC1220 7.1 CH HD Audio Codec, Nahimic Audio
• 3 SATA3
• 1 Blazing M.2 (PCIe Gen5x4)
• 1 Hyper M.2 (PCIe Gen4x4)
• 1 Thunderbolt™ 4 Type-C (Rear)
• 1 USB 3.2 Gen2 Type-C (Front)
• 2 USB 3.2 Gen2 Type-A (Rear)
• 6 USB 3.2 Gen1 (4 Rear, 2 Front)
• 3 USB 2.0 (1 Rear, 2 Front)
• Realtek 2.5G LAN
• 802.11axe Wi-Fi 6E + Bluetooth
• Supports BIOS Flashback, Memory OC Shield

• 10+1+1+1+1 Power Phase Design – Featuring sturdy components and completely smooth power delivery to the CPU. Plus, it offers unmatched overclocking capabilities and enhanced performance with the lowest temperature for advanced gamers as well.
• SPS (Smart Power Stage) – Dr.MOS design features the latest SPS (Smart Power Stage) technology. It’s optimized for monitoring current and temperature of each phase, thus delivering smoother and neater power to the CPU with enhanced performance and OC capability.
• Dr. MOS – Dr.MOS is the integrated power stage solution which is optimized for synchronous buck-set down voltage applications! Compared to traditional discrete MOSFETs, it intelligently delivers higher current for each phase, thus providing improved thermal result and superior performance.
• Hi-Density Power Connector – CPU overclocking requires higher current. ASRock Hi-Density Power Connectors are designed to withstand higher currents compared to traditional CPU and ATX power connectors, providing a more stable system and reducing the risk of fire during heavy overclocking.
• 10 Layer PCB – The 10 Layer PCB provides stable signal traces and power shapes delivering lower temperature and higher energy efficiency for memory overclocking! Thus, it's able to support the latest memory modules with most extreme memory performance!
• DDR5 XMP & EXPO Support – Derived from the “built f