Asrock B860 STEEL LEGEND WIFI, Intel B860, 1851, ATX, 4 DDR5, HDMI, DP, TB4, Wi-Fi 6E, 2.5G LAN, RGB, 4x M.2

£193.71

  Steel Legend represents the philosophical state of rock-solid durability and irresistible aesthetics. Built around most demanding specs and features, the Steel Legend series aims at daily users and mainstream enthusiasts! Providing a …

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SKU: ASMBB860STEELLEGENDWIFI Categories: ,

Description

 

Steel Legend represents the philosophical state of rock-solid durability and irresistible aesthetics. Built around most demanding specs and features, the Steel Legend series aims at daily users and mainstream enthusiasts! Providing a strong array of materials/components to ensure a stable and reliable performance.

  • Supports Intel® Core™ Ultra Processors (Series 2)
  • 14+1+1+1+1 Phase Power Design, 80A Dr.MOS for VCore+GT+SA
  • 4 x DDR5 DIMMs
  • Supports Dual Channel, up to 8666+ (OC)
  • 1 PCIe 5.0 x16, 1 PCIe 4.0 x16
  • Graphics Output Options: 1 HDMI, 1 DisplayPort, 1 Thunderbolt™ 4 Type-C
  • Realtek ALC1220 7.1 CH HD Audio Codec, Nahimic Audio
  • 1 Blazing M.2 (PCIe Gen5x4)
  • 2 Hyper M.2 (PCIe Gen4x4)
  • 1 M.2 (PCIe Gen4x2)
  • 4 SATA3
  • 1 Thunderbolt™ 4 Type-C (Rear)
  • 1 USB 3.2 Gen2x2 Type-C (Front)
  • 2 USB 3.2 Gen2 (Rear)
  • 8 USB 3.2 Gen1 (4 Rear, 4 Front)
  • 7 USB 2.0 (3 Rear, 4 Front)
  • Realtek 2.5G LAN
  • 802.11axe Wi-Fi 6E + Bluetooth
  • Supports Lite Release Design,
  • Toolless Multi-Layer M.2 Heatsink
 
 
 
 
 
Performance
  • Exclusive 20K Cap with 1000uF Capacitance – The upgraded 20K Black capacitor not only extends the lifespan to 20,000 hours but also increases the capacitance value from 560uF to 1000uF
  • 14+1+1 Power Phase Design – Featuring sturdy components and completely smooth power delivery to the CPU. Plus, it offers unmatched overclocking capabilities and enhanced performance with the lowest temperature for advanced gamers as well.
  • Dr. MOS – Dr.MOS is the integrated power stage solution which is optimized for synchronous buck-set down voltage applications! Compared to traditional discrete MOSFETs, it intelligently delivers higher current for each phase, thus providing improved thermal result and superior performance.
  • Hi-Density Power Connector – CPU overclocking requires higher current. ASRock Hi-Density Power Connectors are designed to withstand higher currents compared to traditional CPU and ATX power connectors, providing a more stable system and reducing the risk of fire during heavy overclocking.
  • 2oz Copper PCB – 2 ounce copper inner layers that provide stable signal traces and power shapes! Delivering lower temperature and higher energy efficiency for overclocking.
  • DDR5 XMP & EXPO Support</stron

Additional information

Weight 0.0 g

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