Asrock B850M RIPTIDE WIFI, AMD B850, AM5, Micro ATX, 4 DDR5, HDMI, DP, Wi-Fi 7, 2.5G LAN, RGB, 3x M.2

£162.22

  Riptide is named after a specific kind of water current with strong waves that occurs in the ocean, representing the philosophy of sea’s double-side, calm and unlimited strength. Built around powerful gaming-related features, the …

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SKU: ASMBB850MRIPTIDEWIFI Categories: ,

Description

 

Riptide is named after a specific kind of water current with strong waves that occurs in the ocean, representing the philosophy of sea’s double-side, calm and unlimited strength. Built around powerful gaming-related features, the Riptide has given a powerful smash and immersed users in the sense of stability.

  • Supports AMD Socket AM5 Ryzen™ 9000, 8000 and 7000 Series Processors
  • 12+2+1 Phase Power Design, Dr.MOS for VCore+SOC+MISC
  • 4 x DDR5 DIMMs
  • Supports Dual Channel, up to 8000+ (OC)
  • 1 PCIe 5.0 x16, 1 PCIe 4.0 x4
  • Graphics Output Options: 1 HDMI, 1 DisplayPort
  • Realtek ALC1220 7.1 CH HD Audio Codec, Nahimic Audio
  • 1 Blazing M.2 (PCIe Gen5x4)
  • 1 Hyper M.2 (PCIe Gen4x4)
  • 1 M.2 (PCIe Gen4x2)
  • 4 SATA3
  • 2 USB 3.2 Gen2 Type-A+C (Rear)
  • 1 USB 3.2 Gen1 Type-C (Front)
  • 6 USB 3.2 Gen1 (2 Rear, 4 Front)
  • 8 USB 2.0 (4 Rear, 4 Front)
  • Realtek 2.5G LAN
  • 802.11be WiFi 7 +Bluetooth
  • Supports M.2 Bottom Heatsink, BIOS Flashback

 

 

 

Performance
  • Exclusive 20K Cap with 1000uF Capacitance – The upgraded 20K Black capacitor not only extends the lifespan to 20,000 hours but also increases the capacitance value from 560uF to 1000uF
  • 12+2+1 Power Phase Design – Featuring sturdy components and completely smooth power delivery to the CPU. Plus, it offers unmatched overclocking capabilities and enhanced performance with the lowest temperature for advanced gamers as well.
  • Dr. MOS – Dr.MOS is the integrated power stage solution which is optimized for synchronous buck-set down voltage applications! Compared to traditional discrete MOSFETs, it intelligently delivers higher current for each phase, thus providing improved thermal result and superior performance.
  • Hi-Density Power Connector – CPU overclocking requires higher current. ASRock Hi-Density Power Connectors are designed to withstand higher currents compared to traditional CPU and ATX power connectors, providing a more stable system and reducing the risk of fire during heavy overclocking.
  • 2oz Copper PCB – 2 ounce copper inner layers that provide stable signal traces and power shapes! Delivering lower temperature and higher energy efficiency for overclocking.
  • DDR5 XMP & EXPO Support – Derived from the “built for stable and reliable” designing concept, ASRock does not compromise on any details. This motherboard is built with hi

Additional information

Weight 0.0 g

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